Epi-Ready Polished Substrates

 

Product Specifications

EPI-Ready Polished Substrates

 

Material

  • ES2 High Purity Sapphire (99.999%)

Bubble/Color

  • None by visual inspection under high
    intensity light

Grain Boundary/Lineage

  • None by visual inspection under Lineage polarized light

Orientation

  • C–Plane (0001)
  • A–Plane (11-20)
  • R–Plane (10-12)
  • M–Plane (10-10)
  • Random

Orientation Tilt Tolerance

  • Customer Preference
  • up to 6” ±0.05
  • up to 8” ±0.10

Diameter

  • Up to 200 mm

Flatness (Focal Plane Deviation)

  • Up to 6” ≤4.0 μm
  • Up to 8” ≤6.0 μm

BOW

  • Up to 6” 0 ± 15 μm
  • Up to 8” 0 ± 20 μm

WARP

  • Up to 6” ≤30 μm
  • Up to 8” ≤40 μm

TTV

  • Up to 8” ≤20 μm

Thickness Tolerance

  • Customer Preference
  • ± 25 μm

Surface Finish

  • Up to Ra ≤ 0.2 nm for front side
  • Up to Ra ≤ 1 μm for back side

Orientation Flat/Notch

  • SEMI/JEITA standard

Edge Bevel

  • Industry Standard

Cleanliness

  • Surface to be free from all visual contaminants

Packaging

  • Vacuum-sealed containers with nitrogen backfill in a class 100 environment

Available Options

  • Laser Marking
  • Optical Polished Finish
  • Single Side Epi Ready Finish
  • Double Side Epi Ready Finish

 


 

Custom Specifications not listed above are also available

 

Rubicon’s sapphire epi-polished wafers are ultra-flat, super clean, stress-free large diameter substrates, offered with precision orientations and offsets and wafer-to-wafer uniformity, with one or both surfaces finished. These sapphire wafers are custom designed to meet customers’ unique specifications for final application.

Product Specifications